In the silver plating of copper, K [Ag (CN_2]. is used instead of AgNO_3 . The reason is:

Correct answer: D. less availability of Ag^ + ions, as Cu cannot displace Ag from [Ag(CN_2]^ - . ion Copper being more electropositive readily precipitate silver from their salt ( (Ag^ + ) solution. ( Cu+ 2 AgNO_ 3 arrow Cu(NO_ 3 )_2+ Ag In ( K[Ag(CN)_ 2]) solution a complex anion ([Ag(CN)_ 2]) is formed so ( Ag^ + ions are less available in the solution and Cu cannot displace Ag from this complex ion.

NEET 2002

Exam: NEET
Year: 2002
Subject: Chemistry
Chapter: Coordination Compounds

NEET 2002 · Chemistry · Coordination Compounds

In the silver plating of copper, K [Ag (CN_2]. is used instead of...

In the silver plating of copper,

\mathrm{K}

\left[\mathrm{Ag}

\left(\mathrm{CN}_2\right]\right.

is used instead of

\mathrm{AgNO}_3

. The reason is:

Options

Aa thin layer of $\mathrm{Ag}$ is formed on $\mathrm{Cu}$
Bmore voltage is required
C $\mathrm{Ag}^{+}$ ions are completely removed from solution
Dless availability of $\mathrm{Ag}^{+}$ ions, as $\mathrm{Cu}$ cannot displace $\mathrm{Ag}$ from \left[\mathrm{Ag}\left(\mathrm{CN}_2\right]^{-}\right. ion

Correct answer

D. less availability of $\mathrm{Ag}^{+}$ ions, as $\mathrm{Cu}$ cannot displace $\mathrm{Ag}$ from \left[\mathrm{Ag}\left(\mathrm{CN}_2\right]^{-}\right. ion

Step-by-step solution

Copper being more electropositive readily precipitate silver from their salt (

\left(\mathrm{Ag}^{+}\right)

solution. (

\mathrm{Cu}+

\mathrm{AgNO}_{3} \rightarrow \mathrm{Cu}\left(\mathrm{NO}_{3}

\right)_2+

\mathrm{Ag}

In (

\mathrm{K}\left[\mathrm{Ag}(\mathrm{CN})_

2\right]) solution a complex anion (\left[\mathrm{Ag}(\mathrm{CN})_

2\right]) is formed so (

\mathrm{Ag}^{+} ions are less available in the solution and Cu cannot displace Ag from this complex ion.

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